Immersion Copper for Plating On Plastics

SILKEN CU 801 is a copper immersion process for plating on plastics, applied after electroless nickel. It produces a uniform, thin copper layer on electroless nickel prior to an electrolytic copper deposit.


Features & Benefits

  • Good adhesion on electroless nickel for plating on plastics
  • Easy integrable in existing POP line
  • Less costly compared to pre Nickel
  • Increases Yield in a POP line
  • A bright copper acid layer can be applied directly onto the deposit

Fields of application

  • Automotive
  • Sanitary Fittings
  • Electronics & Connectors
  • Household appliance. e.g. wash machine rings
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