An Extremely Solderable Lead Free Plating Process

The STARGLO BIS-TIN is an extremely solderable lead free plating process that creates a fine-grained, satin-like Tin-Bismuth deposit.
It produces a nominal 95/5 Tin-Bismuth alloy that virtually eliminates latent Tin whiskering, problematic to all 100% tin electroplated deposits.
The process operates with a single proprietary liquid is used for both, new bath make-up and normal replenishment, allowing for a lower total number of additives in a job shop environment. Small additions of STARGLO Anti-Ox are suggested though, in order to retard the build-up of stannic tin in the operating baths.

Features & Benefits

  • Lead Free
  • Non-whiskering deposit
  • Very high degree of uniformity of appearance and alloy over a wide range of current densities
  • Low organic occlusion in the deposit
  • Outstanding reflow and solderability characteristics
  • Improved tolerance to presence of excess addition agent without affecting low current density performance

Fields of application

  • Automotive industry
  • Bathroom accessories
  • Building hardware
  • Shelving
  • Handtools

This process belongs toSTARGLO LINE

STARGLO is a range of Sulfuric/Sulfonic Acid based Systems for Tin and Tin alloy plating.

Fields of application

  • Automotive industry
  • Bathroom accessories
  • Building hardware
  • Shelving
  • Handtools
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