Alkaline Cyanide-free Copper-Plating Process

DIASTAR 100 is an alkaline, cyanide-free high performance Copper plating process for deposition on Steel, Copper alloys, Zinc die cast and Aluminium.
The process is especially suited for fast deposition of bright, pore free deposits in a wide range of current densities.
Due to its excellent throwing power, Steel and Copper alloys can be plated directly without any sub-layer.
Zinc die cast and zincated Aluminium can be plated in rack applications or barrel applications with the use of DIASTAR Strike.

Features & Benefits

  • Environmentally friendly-cyanide free
  • Excellent low current density performance
  • Excellent throwing power and covering power
  • Semi-bright to bright deposit
  • Pit-free deposit
  • Low copper concentration: 6-10 g/l
  • Good plating speed
  • Rack and Barrel applications

Fields of application

  • Automotive
  • Sanitary fittings
  • Lighting
  • Furniture
  • Building (door and lock hardware)

This process belongs toDIASTAR LINE

DIASTAR Line contains non-cyanide alkaline copper processes specifically developed to be an environmentally friendly replacement to cyanide copper based processes. Processes for plate and strike applications have been developed allowing for the processing in rack and barrel applications.

The line contains technologies for the processing of copper on steel, copper alloys, zinc die cast and aluminum.

Fields of application

  • Sanitary fittings
  • Automotive exterior and interior trim and accessories
  • Lighting
  • Furniture
  • Building (door and lock hardware)
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