Gold - PARELEC
PARELEC processes are recommended especially for the treatment of connectors, printed circuits and electrical contacts, either by rack, barrel or continuous operation. At equivalent Gold concentrations, the PARELEC processes offer a plating speed of 1½ to twice faster than traditional baths. Alternatively, equivalent plating speeds can be achieved at half the Gold concentration.
Due to a high tolerance to metallic impurities and a wide range of permissible current densities, PARELEC electrolytes are easy to use and have an increased bath life.
Your contact, USA
Brad Durkin +1 734 731 5180
Er kontakt, SWEDEN
Per Alsin + 46 70 633 99 21
Your contact, CHINA
Jean-Michel GUILLOT +86 138 1610 4680