Products - Functional

Electroless Nickel

ENOVA Line

ELECTROLESS NICKEL is widely accepted as the coating most engineers turn to for their most challenging applications. Resistance to wear and corrosion are just a few of the reasons why this diverse product line has become an integral part of the plating universe.

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Tin

STABAC 200

STABAC 200 is a bright acid Tin plating process that produces brilliant deposits, which are both dense and high levelling. The finish achieved does not tarnish with handling and has excellent solderability.

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Gold Plating

PARELEC

PARELEC processes are recommended especially for the treatment of connectors, printed circuits and electrical contacts, either by rack, barrel or continuous operation. At equivalent Gold concentrations, the PARELEC processes offer a plating speed of 1½ to twice faster than traditional baths.

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Copper Plating

CUBRAC 500 Line

The CUBRAC 500 Line provide fast plating of bright and hard Copper deposits. The hardness remains for an exceptionally long time and the plated cylinders are particularly well adapted to the rotogravure or printing industry.

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Functional Process Catalog

The Functional Line Functional Process Catalog

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