Copper - DIASTAR 100
DIASTAR 100 is an alkaline, cyanide-free high performance Copper plating process for deposition of Copper on Steel, Copper alloys, Zinc die cast and Aluminium. The process is especially suited for fast deposition of bright, pore free deposits in a wide range of current densities. The Copper deposits are very ductile.
Due to its excellent throwing power, Steel and Copper alloys can be plated directly without any sub-layer. Zinc die cast and zincated Aluminium can be plated in rack applications.
Your contact, USA
Brad Durkin +1 734 731 5180
Doug Lay +1 330 284 3763
Er kontakt, SWEDEN
Per Alsin + 46 70 633 99 21
CHINA: Jean-Michel Guillot +86 13816104680