Products - Copper

CUBRAC 400 & 600 Lines

CUBRAC is a family of acid bright Copper plating processes. All CUBRAC processes provide excellent levelling, perfect brightness and outstanding bright throwing power. The processes yield top performance even at elevated temperatures and show no tendency for pitting, even at high thickness.

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DIASTAR 100

DIASTAR 100 is an alkaline, cyanide-free high performance Copper plating process for deposition of Copper on Steel, Copper alloys, Zinc die cast and Aluminium. The process is especially suited for fast deposition of bright, pore free deposits in a wide range of current densities. The Copper deposits are very ductile.

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