Products - Decoration

POP

SILKEN Line

SILKEN is a process line for the pre-treatment of ABS - ABS/PC and PP-plastic materials for Electroplating. Sanitary fittings, automotive and electronics are the main users of this technology. The SILKEN Line includes products for all process steps from pre-cleaning to etching to Electroless Nickel plating.

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SILKEN ETCH 301

SILKEN ETCH 301 is a newly developed etching process for ABS - ABS/PC- and PP plastic materials. With SILKEN ETCH 301, it is possible to operate at low chromic acid concentration while obtaining an improved, uniform etching result.

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SILKEN CATALYST 501

SILKEN CATALYST 501 is a colloidal Palladium/Tin activator used for plating on plastic applications. The product is characterized by an especially fine colloid particle size. It allows a very efficient activation of the plastic surface prior to the electroless plating step to SILKEN METAL 701.

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SILKEN METAL 701

SILKEN METAL 701 is an ammonia-free Electroless Nickel process used for the pre-treatment of plastic materials. The electrolyte is free of heavy metal stabilizers.

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Nickel

CRYSTAL

CRYSTAL processes are bright Nickel plating processes that provide improved brightness, levelling and ductility, with a good Chrome receptivity.

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CRYSTAL BARREL

CRYSTAL BARREL is a bright Nickel barrel plating process with improved brightness, ductility and levelling.

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SATIN CRYSTAL

SATIN CRYSTAL processes enable deposition of various matte/satin aspects. The deposits are uniform with non-reflecting properties. The intensity of the matte/satin can easily be adjusted for a perfect tailor-made deposit. The colour can vary from white to grey and the brightness can be regulated.

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CRITERION SB 100

The CRITERION SB 100 semi-bright Nickel process offers improved levelling and ductility. Its deposits are free from sulphur. The structure of the deposit is columnar, which makes it perfect for its application on the anti-corrosive bi-Nickel and tri-Nickel COVENTYA systems.

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CRITERION MP 200

CRITERION MP 200 is an electrolytic Nickel plating process used on bright Nickel and its prior Chromium plating that gives a microporous Chrome deposit on bright Nickel surfaces. The superficial microporosity, generated by plating Chromium over inert particles containing Nickel, enhances the corrosion resistance of the system.

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CRITERION MC 300

CRITERION MC 300 provides a tiny and consistent microcracked structure of the last two Nickel and Chromium layers on bright Nickel. The microdiscontinuous structure enhances the corrosion protection by spreading the corrosion over the plated surface in all microscopic sites.

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ALFA C20

ALFA C20 is a high-speed Nickel plating process. It is used on a reel to reel plant. This process produces a semi-bright and ductile deposit for plating i.e. electronic equipments.

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CRYSTAL BLACK

CRYSTAL BLACK is a flash electroplating process producing a bright Nickel layer with a ‘gun’ tint.

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Tin Alloys

CEDIA

CEDIA is an electrolytic process used to plate flash deposits of Tin-Cobalt alloy. This coating could be an alternative to decorative Chromium. The deposits obtained have a good corrosion and resistance to tarnish.

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NISTLA

NISTLA processes are electrolytic, Tin-Nickel processes that produce grey to grey/black aspects. They can be used for technical or decorative applications, such as for lighting and sanitary fittings accessories.

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Chrome

TRISTAR Line

TRISTAR represents an important advancement in the technology of high performance addition agent systems for conventional and black trivalent chrome plating. It provides a remarkably uniform performance over a wide range of current densities and operating conditions in an economical manner.

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Chrome 200 Line

CHROME 200 is a decorative, bright Chromium plating process based on chromic acid. Excellent bright, White Chromium deposits are obtained by using CHROME 200. The process is characterized by excellent throwing power and a wide applicable temperature range. CHROME 200 works with a liquid catalyst and is very economic in use.

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Copper

CUBRAC 400 & 600 Lines

CUBRAC is a family of acid bright Copper plating processes. All CUBRAC processes provide excellent levelling, perfect brightness and outstanding bright throwing power. The processes yield top performance even at elevated temperatures and show no tendency for pitting, even at high thickness.

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DIASTAR 100

DIASTAR 100 is an alkaline, cyanide-free high performance Copper plating process for deposition of Copper on Steel, Copper alloys, Zinc die cast and Aluminium. The process is especially suited for fast deposition of bright, pore free deposits in a wide range of current densities. The Copper deposits are very ductile.

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Decorative Process Catalog

The Decorative Line Decorative Process Catalog

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